ChemicalBook CAS DataBase List 3-Hydroxyphenylphosphinyl-propanoic acid

3-Hydroxyphenylphosphinyl-propanoic acid synthesis

4synthesis methods

Product Name:3-Hydroxyphenylphosphinyl-propanoic acid
CAS Number:14657-64-8
Molecular formula:C9H11O4P
Molecular Weight:214.15

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79-10-7 Synthesis

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3-Hydroxyphenylphosphinyl-propanoic acid

14657-64-8
283 suppliers
$5.00/1g

Yield:14657-64-8 98%

Reaction Conditions:

Stage #1:Dichlorophenylphosphine;acrylic acid at 80 - 110; for 3 h;
Stage #2: with water at 90; for 3 h;Temperature;Concentration;

Steps:

5.1; 5.2; 5.3; 5.4 Example 5 A process for the production of 2-carboxyethylphenylphosphinic acid with no waste water as mentioned in the present invention.
A process for the production of 2-carboxyethylphenylphosphinic acid in accordance with the present invention without waste water,Next:(1) 1.0 mol of phenylphosphine dichloride was charged into a reaction vessel, stirred, heated to 80 ° C, 1 mol of acrylic acid was added dropwise,Finished warming to 110 deg C , heat 3 hours, cooling to 50 deg C ; (2) To the liquid obtained in the step (1), 2.0 mol of dichloropropane (secondary used mother liquor,Material complement), stirring;(3) to the step (2) to slowly drop 1.0mol of water, acid chloride intermediates and water hydrolysis reaction, drop finishedHeating to 90 DEG C, keeping for 3 hours, cooling to 20 DEG C to produce 2-carboxyethylphenylphosphinic acid, and recovering by-product hydrochloric acid.(4) The solid-liquid mixture obtained in step (3) was filtered, washed with dichloropropane, filtered again, placed in an oven,Baking at 130 ° C for 2 hours to obtain 2-carboxyethylphenylphosphinic acid, and the mother liquor was recovered in the next batch. The yield of 2-carboxyethylphenylphosphinic acid was 98.0%, the melting point was 160.2 deg C , the acid value (mgKOH / g) was 522, the phosphorus content was 14.35%, and the product quality was excellent.

References:

Dongying Merida new materials Technology Co., Ltd;Zhang, Guixin;Guo, Qing;Zhang, Hua CN105541908, 2016, A Location in patent:Paragraph 0023; 0024

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