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相變材料,BERGQUIST HF300P HI-FLOW THF 1600P HI-FLOW 300P
  • 相變材料,BERGQUIST HF300P HI-FLOW THF 1600P HI-FLOW 300P
  • 相變材料,BERGQUIST HF300P HI-FLOW THF 1600P HI-FLOW 300P
  • 相變材料,BERGQUIST HF300P HI-FLOW THF 1600P HI-FLOW 300P

BERGQUIST HF300P HI-FLOW THF 1600P HI-FLOW 300P

價(jià)格 詢價(jià)
包裝 1ROLL
最小起訂量 10000ROLL
發(fā)貨地 廣東
更新日期 2023-07-02

產(chǎn)品詳情

中文名稱:相變材料英文名稱:BERGQUIST HF300P HI-FLOW THF 1600P HI-FLOW 300P
品牌: BERGQUIST產(chǎn)地: USA
產(chǎn)品類別: Hi Flow
型號(hào): HF300P外形尺寸: 279MM*76.2M
2023-07-02 相變材料 BERGQUIST HF300P HI-FLOW THF 1600P HI-FLOW 300P 1ROLL/1RMB 1 BERGQUIST USA Hi Flow

    BERGQUIST HI-FLOW THF 1600P  Features and Benefits

    ? Thermal impedance: 0.13°C-in.2/W

    (at 25 psi)

    ? Field-proven polyimide film; excellent

    dielectric performance; excellent cutthrough

    resistance

    ? Outstanding thermal performance in an

    insulated pad

BERGQUIST HF300P  HI-FLOW 300P  HI-FLOW THF 1600P

BERGQUIST HI-FLOW THF 1600P consists of a thermally conductive 55°C phase change compound

 coated on a thermally conductive polyimide film. The polyimide reinforcement makes the material easy

to handle and the 55°C phase change temperature minimizes shipping and handling problems.

BERGQUIST HI-FLOW THF 1600P achieves outstanding values in voltage breakdown and thermal 

performance. The product is supplied on an easy release liner for exceptional handling in high

volume manual assemblies. BERGQUIST HI-FLOW 300P is designed for use

as a thermal interface material between  electronic power devices requiring electrical isolation to the 

heat sink.


BERGQUIST  HF300P Typical Applications Include:

? Spring or clip-mounted

? Discrete power semiconductors and modules

Configurations Available:

? Roll form, die-cut parts and sheet form, dry both sides


關(guān)鍵字: BERGQUIST HF300P;HI-FLOW THF 1600P;HI-FLOW 300P;

公司簡(jiǎn)介

Shenzhen Hothree Technology Co., Ltd. was established in 2011. It is a technology-oriented company that is oriented to customer needs and is committed to providing customers with professional solutions for thermal conduction and EMI electromagnetic compatibility problems. The company mainly distributes thermal interface materials and shielding (EMI) materials for well-known brands such as Bergquist ,LAIRD in the US and Denka in Japan. At the same time, the company is also developing and integrating new high-performance products to meet system designers' requirements for thermal conductivity. Products are widely used in 5G communications, optical modules, security electronics, automotive electronics, outdoor base stations, lithium batteries, mobile phones, computers, LED, instruments, aerospace and medical equipment. Company culture, Integrity and pragmatism, quick response, keep improving.
成立日期 2013-03-23 (12年) 注冊(cè)資本 300萬人民幣
員工人數(shù) 1-10人 年?duì)I業(yè)額 ¥ 1000萬-5000萬
主營(yíng)行業(yè) 聚合物材料,特種纖維及高功能材料,工業(yè)膠水 經(jīng)營(yíng)模式 貿(mào)易
  • 深圳市華思瑞科技有限公司
非會(huì)員
  • 公司成立:12年
  • 注冊(cè)資本:300萬人民幣
  • 企業(yè)類型:有限責(zé)任公司
  • 主營(yíng)產(chǎn)品:美國(guó)BERGQUIST、日本DENKA等導(dǎo)熱絕緣材料
  • 公司地址:Building F3, Jinyucheng Park, Longgang District
詢盤

BERGQUIST HF300P HI-FLOW THF 1600P HI-FLOW 300P相關(guān)廠家報(bào)價(jià)

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¥800
VIP11年
福斯曼科技(北京)有限公司
2025-01-10
¥500
VIP5年
浙江亞美納米科技有限公司
2025-01-10
詢價(jià)
VIP4年
恩聯(lián)生物醫(yī)藥(重慶)有限公司
2025-01-09
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