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導(dǎo)熱硅膠墊片,BERGQUIST GPHC3.0 GAP PAD HC 3.0 GAP PAD TGP HC3000
  • 導(dǎo)熱硅膠墊片,BERGQUIST GPHC3.0 GAP PAD HC 3.0 GAP PAD TGP HC3000
  • 導(dǎo)熱硅膠墊片,BERGQUIST GPHC3.0 GAP PAD HC 3.0 GAP PAD TGP HC3000

BERGQUIST GPHC3.0 GAP PAD HC 3.0 GAP PAD TGP HC3000

價(jià)格 詢價(jià)
包裝 1SHEET
最小起訂量 1000SHEET
發(fā)貨地 廣東
更新日期 2023-06-30

產(chǎn)品詳情

中文名稱:導(dǎo)熱硅膠墊片英文名稱:BERGQUIST GPHC3.0 GAP PAD HC 3.0 GAP PAD TGP HC3000
品牌: BERGQUIST產(chǎn)地: USA
產(chǎn)品類別: GAP PAD
型號(hào): GPHC3.0外形尺寸: 203*406MM
2023-06-30 導(dǎo)熱硅膠墊片 BERGQUIST GPHC3.0 GAP PAD HC 3.0 GAP PAD TGP HC3000 1SHEET/1RMB 1 BERGQUIST USA GAP PAD

    BERGQUIST  GPHC3.0 Features and Benefits

    ? Thermal conductivity: 3.0 W/m-K

    ? High-compliance, low

    compression stress

    ? Fiberglass-reinforced for shear and tear

    resistance

BERGQUIST GPHC3.0,GAP PAD  HC 3.0,GAP PAD TGP HC3000 

BERGQUIST GAP PAD TGP HC3000 (thermal pad) is a soft and compliant gap filling material with a thermal conductivity 

of 3.0 W/m-K.The material offers exceptional thermal performance at low pressures due to a unique 3.0 W/m-K 

filler package and lowmodulus resin formulation. The enhanced material is ideal for applications requiring

low stress on components and boards during assembly. BERGQUIST GPHC3.0(BERGQUIST thermal pad) maintains a conformable

nature that allows for quick recovery and excellent wet-out characteristics, even to surfaces with high roughness 

and/or topography.


BERGQUIST  GAP PAD HC 3.0 Typical Applications Include:

? Telecommunications

? ASICs and DSPs

? Consumer electronics

? Thermal modules to heat sinks

Configurations Available:

? Sheet form and die-cut parts

關(guān)鍵字: BERGQUIST GPHC3.0;GAP PAD TGP HC3000;GAP PAD HC 3.0;

公司簡(jiǎn)介

Shenzhen Hothree Technology Co., Ltd. was established in 2011. It is a technology-oriented company that is oriented to customer needs and is committed to providing customers with professional solutions for thermal conduction and EMI electromagnetic compatibility problems. The company mainly distributes thermal interface materials and shielding (EMI) materials for well-known brands such as Bergquist ,LAIRD in the US and Denka in Japan. At the same time, the company is also developing and integrating new high-performance products to meet system designers' requirements for thermal conductivity. Products are widely used in 5G communications, optical modules, security electronics, automotive electronics, outdoor base stations, lithium batteries, mobile phones, computers, LED, instruments, aerospace and medical equipment. Company culture, Integrity and pragmatism, quick response, keep improving.
成立日期 2013-03-23 (12年) 注冊(cè)資本 300萬人民幣
員工人數(shù) 1-10人 年?duì)I業(yè)額 ¥ 1000萬-5000萬
主營(yíng)行業(yè) 聚合物材料,特種纖維及高功能材料,工業(yè)膠水 經(jīng)營(yíng)模式 貿(mào)易
  • 深圳市華思瑞科技有限公司
非會(huì)員
  • 公司成立:12年
  • 注冊(cè)資本:300萬人民幣
  • 企業(yè)類型:有限責(zé)任公司
  • 主營(yíng)產(chǎn)品:美國BERGQUIST、日本DENKA等導(dǎo)熱絕緣材料
  • 公司地址:Building F3, Jinyucheng Park, Longgang District
詢盤

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