Appearance
White powder
Purity
≥ 98.0%
Water content
≤0.5%
HFHA/m-6FDAP is used as intermediate for preparing surface protective film, interlayer insulating film and flat film of semiconductor components. It is soluble in N, N-dimethylformamide and N-methylpyrrolidone, soluble in ethylene glycol monomethyl ether, slightly soluble in methanol and ethanol, and almost insoluble in water.
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